Outer layer copper thickness: 1oz
Solder pad surface treatment: Hot air leveling (HASL) with tin
Base material: ROGERS
Solder mask color: Green
Legend color: White
Circuit process: Photolithography process
Special process: Plated half-holes
Solder mask process: Silk screen printing and exposure
Minimum line width/spacing: 3/3mil
Applicable industries: Telecommunications, wireless base stations, communication systems, 

military equipment, maritime and aerospace systems, medical, automotive, and various smart electronic products, etc.
Solder mask coverage: Via plugging
Minimum hole diameter: 0.3
Board thickness: 0.8