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RO3003 high-frequency board

2025-02-13
295

Outer copper thickness: 1/2oz
Pad surface treatment: Electroplated copper
Copper foil type: Electrolytic copper without adhesive
Electromagnetic film: Double-sided
Immersion gold/nickel plating thickness: 2U
Character color: White
Minimum line width/spacing: 0.2mm
Coverlay color: White
Minimum hole diameter: 0.15mm
Board thickness: 0.13mm
Forming method: Die-cutting forming
Applicable industries: Telecommunications, medical, industrial control, automotive electronics, consumer electronics

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