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RO3003 high-frequency board

2025-02-13
242

Outer copper thickness: 1.5oz, 1oz
surface finished: ENIG, Nickel-Palladium-Gold
Forming method: Mechanical forming
Base material: Rogers
Solder mask color: Black, Blue, White, Green
Character color: White
Circuit process: Exposure process
Special processes: Chamfered edges for gold fingers, Metallized half-holes
Solder mask process: Silk screen exposure
Minimum line width/spacing: 0.25mm, 0.2mm
Applicable industries: Telecommunications industry, wireless base stations, communication systems,

military equipment, maritime and aerospace systems, medical, automotive, and various smart electronic products, etc.
Solder mask coverage: Via plugging, Via windowing
Minimum hole diameter: 0.3, 0.25
Board thickness: 1.0, 1.5

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