[Board thickness] 0.6mm-3mm

[Surface treatment] Lead free tin spray / sink / OSP

[line width] < 0.1 M (4mil)

[Line distance] ≥ 0.1 M (4mil)

[Aperture] ≥ 0.5 M in diameter

[E-T Test]  Computer Open Short Circuit Test

[Peel strength] 1.8 kgf / cm

[Thickness of copper foil] 250 nm ~ 18um

[CNC) 0.IMM-0.15MM

[Die Punch] Soil 0.125 MM

[Monthly production capacity] more than 50,000 square meters

[Character line width] ≥ 0.125 M

[Size] 5mm * 5mm-1500mm * 500mm

[Type of solder mask] White oil or various colors solder mask

[Plate warpage] 0.5% (size 350MM * 350MM)

[Metal material] Aluminum substrate, steel substrate, aluminum-copper composite, glass fiber board

[Forming Method] CNC Computer Gong / Die Punching / Computer v-CUT External Tolerance