Number of layers: 14L
Material: TU872SLK  
Board thickness: 1.6 ± 0.05mm
Copper thickness: 1oz
Surface finished：ENIG

thickness: 0.05um + gold finger

thickness: 15u'
Outer layer trace width/spacing: 75/75um
Minimum hole diameter: Mechanical hole: 0.2mm

board thickness to hole diameter ratio: 8:1
Solder mask and legend color: Green oil with white 

The high-speed computer gold finger interconnect board is one of the high-speed series of circuit boards 

developed and produced by Shenzhen Huashengxin Precision Circuit Co., Ltd. 

It adopts TU872SLK high-speed material, pure lamination, immersion gold surface treatment, 

and thick gold plating on the gold fingers. This product is widely used in high-speed computers and high-end servers in cloud data centers, 

and is characterized by stability and durability.