Outer layer copper thickness: 2oz
Half-hole on one side, half-hole on the other
Pad surface treatment: Electroplated gold
Solder mask color: Green
Character color: White
Circuit process: Pattern plating
Special process: Metallized half-hole
Solder mask process: Immersion silver
Minimum line width/spacing: 0.5mm
Solder mask coverage: Via plug with resin + via plated cap
Minimum via diameter: 0.4
Board thickness: 0.8
Forming method: Laser cutting
Applicable industries: Communications, Electronics