Board Thickness:
Definition: The thickness of the aluminum substrate, typically measured in millimeters (mm).
Common Specifications: 0.8mm, 1.0mm, 1.2mm, 1.6mm, etc.
Importance: Affects the mechanical strength, thermal performance, and current carrying capacity of the aluminum substrate.

Aluminum Material:
Definition: The type of aluminum material used in the aluminum substrate, commonly including 1060, 5052, 6061, etc.
Characteristics: Different grades of aluminum have varying chemical compositions, mechanical properties, and thermal properties.
Selection: Choose the appropriate aluminum material based on the application scenario, such as 5052 for good corrosion resistance or 6061 for higher strength and hardness.

Thermal Conductivity:
Definition: The thermal performance of the aluminum substrate, measured in watts per meter kelvin (W/m·K).
Importance: Affects the heat dissipation of heat-generating components like LED lights; the higher the thermal conductivity, the better the heat dissipation.
Common Values: Varies depending on the insulation layer material and aluminum material, typically ranging from 1-3 W/m·K.

Insulation Layer:
Definition: The insulating material located between the aluminum plate and the copper foil, often made of ceramic, polyimide (PI), or other insulating materials.
Function: Provides electrical insulation, preventing current from flowing directly through the aluminum plate.
Parameters: Thickness, thermal conductivity, dielectric constant of the insulation layer, etc.

Copper Foil Thickness:
Definition: The thickness of the copper foil on the aluminum substrate, measured in micrometers (μm) or ounces (oz).
Common Specifications: 1 oz (approximately 35μm), 2 oz (approximately 70μm), etc.
Importance: Affects the current carrying capacity, solderability of the copper foil, and the cost of the aluminum substrate.

Surface finished:
Definition: The treatment applied to the surface of the aluminum substrate, such as gold plating, silver plating, chemical nickel plating, OSP, etc.
Function: Improves the solderability of the copper foil, prevents oxidation, and enhances aesthetic appeal.
Selection: Choose the appropriate surface treatment based on the soldering process and operating environment.

Solder Pad:
Definition: The area on the aluminum substrate used for soldering LED chips or other electronic components.
Design: The size, shape, and location of the solder pads should be designed according to the component package type and soldering process.

Thermal Vias:
Definition: Through-holes or blind holes on the aluminum substrate used to improve thermal performance.
Function: Transfers heat from the copper foil layer to the aluminum base layer through the thermal vias, enhancing heat dissipation efficiency.

Maximum Operating Temperature:
Definition: The highest operating temperature that the aluminum substrate can withstand.
Importance: Ensures that the aluminum substrate can operate normally in high-temperature environments, preventing damage due to excessive temperature.

Minimum Line Width/Spacing:
Definition: The minimum line width and spacing of the circuits on the aluminum substrate, measured in millimeters (mm) or micrometers (μm).
Importance: Affects the circuit layout density, signal integrity, and manufacturing cost.

Minimum Hole Diameter:
Definition: The smallest diameter of the holes on the aluminum substrate, measured in millimeters (mm) or micrometers (μm).
Importance: Affects the soldering and assembly process of components.

Surface Roughness:
Definition: The roughness of the aluminum substrate surface, typically measured in micrometers (μm).
Importance: Affects the bond strength between the copper foil and the aluminum substrate, solderability, and aesthetic appeal.

Maximum Dimension:
Definition: The maximum size of the aluminum substrate, measured in millimeters (mm).
Importance: Affects the manufacturing difficulty, transportation, and installation cost of the aluminum substrate.

Electrical Performance:
Definition: The electrical properties of the aluminum substrate, such as insulation resistance, withstand voltage, etc.
Importance: Ensures that the aluminum substrate operates normally in electrical environments, preventing damage due to substandard electrical performance.

Mounting Method:
Definition: The method used to install the aluminum substrate, such as bolt fixation, adhesive backing, etc.
Selection: Choose the appropriate mounting method based on the application scenario and installation requirements.