Product Name: 

HDI Second Order 6-Layer Immersion Gold

Product Code:

HDIPCB06002

HDI (High Density Interconnect) 2nd Order 6-Layer Immersion Gold PCB features include:

1. High Density Interconnect

 The HDI design allows for higher wiring densities in limited space for small and complex electronic devices, which is critical for modern high performance electronics.

2. Multiple micro-blind and buried vias

 HDI technology often uses micro-blind and buried vias to reduce surface wiring complexity and improve signal connectivity between multiple layers, enhancing overall electrical performance and reliability.

3. Immersion Gold Finish

The immersion gold process provides excellent solderability and corrosion resistance, which is suitable for high-reliability electronic products, and can effectively reduce contact resistance and improve the quality of signal transmission. In addition, the thickness of the immersion gold layer can be controlled, which is suitable for different application requirements.

4. Multi-layer structure

The 6-layer design provides a good layout for power, ground and signals, and helps reduce electromagnetic interference (EMI) and improve signal integrity.

5. Improved Thermal Performance

Due to the multi-layer structure and gold immersion surface treatment, it helps to improve heat dissipation and adapt to the needs of high-power electronic devices.

6. Flexible Electronic Component Layout

HDI technology supports more types and sizes of electronic components, allowing for flexible layout design to accommodate different functional and performance needs.

7. Reduced Signal Delay

HDI's design can reduce the length of the signal transmission route, thereby reducing signal delay, suitable for high-speed and high-frequency signal transmission.

8. Increased Productivity

HDI technology combined with the immersion gold process can shorten the manufacturing cycle and improve the yield rate, commonly used in mass production.

9. Wide range of applications

This type of PCB is widely used in smart phones, tablets, communication devices, high-definition displays and other electronic products with high performance and space requirements.