Product Name

HDI second-order 12-layer board

Product Code

HDIPCB1220180315

Product Features

HDI (High Density Interconnect) second-order 12-layer boards mainly have the following characteristics:

1. High-density wiring: HDI technology allows for higher density wiring on the PCB, which can support smaller sized electronic components and improve the integration of the board.

2. Multi-layer structure: 12-layer structure can provide more layers in PCB design for signal, ground, power supply and other layouts to improve circuit stability and reliability.

3. Micro-blind and buried vias: HDI boards usually use micro-blind and buried vias technology, which reduces the complexity of wiring, and at the same time can effectively connect signals between multiple layers.

4. Excellent electrical performance: Because the design of HDI boards reduces the impedance and delay of signal transmission, they have better electrical performance and are suitable for high-frequency and high-speed signal transmission.

5. Good heat dissipation performance: Multi-layer structure can better dissipate heat, adapt to the needs of high-power components, and improve the stability of the overall system.

6. Complex manufacturing process: the production of HDI boards involves a high level of process technology and equipment, production costs are relatively high, but has an advantage in performance and reliability.

7. Wide range of applications: Widely used in smart phones, tablet PCs, high-end servers, Internet devices and other areas with high performance and space requirements.