The term "Pattern plating" means the coating (plating) with a pattern (pattern). It therefore describes the selective electroplating of a production panel that has previously been provided with a photomask. In the photo process, the photomask is applied negatively to the panel in order to selectively build up the conductor pattern in the electroplating process. This is therefore also referred to as LBA or the Ladder diagram structure. The areas covered by the photomask are the areas that will be etched away later. To protect the deposited copper from the subsequent etching process, a thin layer of tin is also applied to the copper. This tin layer serves as an etch resist and has no function for the soldering process. It is removed again after the etching process.