Outer copper thickness: 1oz
Pad surface treatment: Immersion gold
Board material option: Flame retardant
Forming method: Membrane punching
Substrate material: ROGERS
Solder mask color: Blue
Character color: White
Special process: Metal edging
Solder mask process: Silk screen exposure
Minimum line width/spacing: 3/3mil
Applicable industries: Telecommunications, wireless base stations, communication systems,

 military equipment, marine and aerospace systems, medical, automotive, and various smart electronic products, etc.
Solder mask coverage: Via plugging
Minimum hole diameter: 0.2
Board thickness: 1.52