Outer copper thickness: 1.5oz
Pad surface treatment: Immersion gold
Insulation layer thickness: 0.8mm
Solder mask color: Yellow
Character color: White
Circuit process: Immersion gold process
Special process: Metal half-hole
Solder mask process: Immersion gold process
Minimum line width/spacing: 0.6mm
Solder mask coverage: Resin plugged holes
Minimum hole diameter: 0.25
Board thickness: 0.76
Substrate material: ROGERS
Applicable industries: Security, Electronics, Communications, Industrial Control, Consumer
Dielectric constant: 3.48
Dielectric thickness: 0.508mm