Outer layer copper thickness: 1.5oz
Half-hole on three sides
Pad surface finish: Immersion Gold
Testing method: AOI full inspection + Flying Probe spot check
Solder mask color: White
Character color: Black
Circuit process: Immersion Gold process
Special process: Metallized half-hole
Solder mask process: Immersion Gold process
Solder mask coverage: Via plugging
Minimum hole diameter: 0.15
Board thickness: 0.8
Product number: RO4003C
Forming method: Laser cutting
Substrate: Rogers
Number of layers: 4
Applicable industries: Military, Communications, Medical, Industrial Control