Outer layer copper thickness: 1oz
Pad surface finish: OSP
Insulation layer thickness: 50μm
Testing method: AOI full inspection + flying probe sampling inspection
Solder mask color: White
Character color: Black
Circuit process: Pattern plating
Special process: Metal edging
Solder mask process: Silk screen exposure
Minimum line width/spacing: 0.1mm
Coverlay color: Yellow
Impedance: Yes
Solder mask coverage: Resin plugged vias
Minimum via diameter: 0.1mm
Board thickness: 0.6mm
Product number: RT5880
Forming method: Laser cutting
Number of layers: 10
Applicable industries: Military, communications, medical, industrial control, automotive electronics, consumer electronics
Specification: Rogers RT5880