Outer layer copper thickness: 1oz
Pad surface treatment: Electroplated gold
Board material option: Flame retardant
Base material: ROGERS
Solder mask color: Green
Character color: White
Circuit process: Exposure process
Special process: Standard process
Solder mask process: Silk screen exposure
Minimum line width/spacing: 3.5/3.5mil
Applicable industries: Telecommunications, wireless base stations, communication systems, 

military equipment, maritime and aerospace systems, medical, automotive, and various smart electronic products, etc.
Impedance: No
Solder mask coverage: Via plugging
Minimum hole diameter: 0.25
Board thickness: 1.6