Outer copper thickness: 0.5oz
Pad surface treatment: Lead-free HASL (Hot Air Solder Leveling)
Substrate material: ROGERS
Solder mask color: Green
Circuit process: Photolithographic process
Special process: Metallized half-hole
Solder mask process: Silk screen exposure
Minimum line width/spacing: 3.5/3.5mil
Applicable industries: Telecommunications, wireless base stations, communication systems, 

military equipment, marine and aerospace systems, medical, automotive, and various smart electronic products, etc.
Solder mask coverage: Via plugging
Minimum hole diameter: 0.3
Board thickness: 1.0