Name: FPC soft and hard bonded board

Mechanical Rigidity: Flexible

Number of layers: Multiple layers

Material: glass fiber + polyimide

Product Type: Hard and Soft Combined Plate

Insulation: Organic Resin

Insulation layer thickness: thin plate

Flame retardant characteristics: V0 plate 

Addition process: calendered foil Reinforcing 

material: glass fiber cloth base

Insulation resin: polyimide resin (PI)

Storage environment: light proof vacuum storage, temperature < 25 ° C humidity < 70%

Product thickness: 0.2mm-1.6mm (tolerance soil 0.03 mm)

Single size: according to the customer's drawing can be customized

Copper foil thickness: 15 / 35 mm (0.50Z)

Solder mask oil: solder mask black oil

Coating and thickness: electro-gold / sinker (2UM-3UM)

Fire rating: 94-VO

Temperature test: thermal shock 288 ° C10SEC

Dielectric constant: PI3.5 AD3.9