Product Name: 

HDI 2-step 6-layer laser drilling and gold sinking

Product Code:

HDIPCB06170906

HDI (2nd order) 6-layer laser drilled immersion gold PCB features include:

1. High Density Interconnect

HDI PCB design allows for high density circuit connections in limited space, suitable for smaller sized electronic products with complex functionality, and can reduce the overall size of the board.

2. Laser drilling technology

Laser drilling allows for smaller diameter holes with high accuracy and is suitable for the manufacture of micro blind and buried holes. This technology avoids the mechanical stress of traditional drilling methods and improves the quality and consistency of the holes.

3. Immersion Gold Finish

The immersion gold process provides excellent solderability and corrosion resistance and is suitable for highly reliable electronic products, ensuring low contact resistance and improved signal transmission quality. The thickness of the immersion layer is controllable and can be adjusted to meet specific needs.

4. Multi-layer structure design

The 6-layer design provides a more flexible hierarchical structure that ensures signal integrity and reduces electromagnetic interference (EMI), in addition to a rational layout of the signal, ground and power layers.

5. Signal Integrity and Reduced Latency

The use of HDI second-order structure reduces the length of the signal transmission path, which helps to improve signal integrity, is suitable for high-speed and high-frequency signal transmission, and reduces signal delay.

6. Excellent Thermal Performance

The multi-layer design helps to disperse heat, thus improving the thermal performance of the PCB, which is suitable for the needs of high-power electronic products.

7. Feature-rich design

HDI technology supports flexible layout of multiple components (e.g., miniature components and high-frequency components), which can meet the application requirements of different electronic products.

8. Wide range of applications

HDI's second-stage, 6-layer, laser-drilled, gold-immersed PCBs are widely used in smartphones, tablet PCs, networking devices, military electronics, medical devices and other electronic products with high performance and volume requirements.

9. Improve production efficiency

The combination of laser drilling technology and gold immersion process improves manufacturing accuracy and production yield, which is suitable for mass production needs.